Multilayer w/Minimum Hole Diameter of .25mm
Ultra fine line w/thin board & small holes
Multilayer Suitable For Bonding & SMT Applications
Multilayer Suitable For Goldwire Bonding Machine
Multilayer w/Line Width of .076mm
6 Layer Suitable for Bonding Machine
6 Layer w/Minimum Line Spacing of .076mm
Multimedia Card w/Aspect Ratio of 6-1 and CEM-3 Base Material